Located on the same floor as the silicon fabrication area, the sensor packaging and system manufacturing area insures optimum conditions for an integrated work-flow for all backend process such as sensor packaging, electrical and spectroscopical characterization, system integration of the packaged sensors and full qualification.
Comprising over 200m² of ISO 5-7 clean room area
Continuous monitoring and control of all environmental conditions to insure highest quality of the final products
Optimized workflow from Chip … to Module … to System
Many years of experience of our employees with sophisticated packaging techniques and detector characterization
State-of-the-art equipment for precise and effective working steps
Easy integration of the detector units into systems
Comprehensive characterization of the final product to insure the best quality
Expertise with customer specific solutions – we fulfill your individual needs and wishes
[Translate to Chinese:] Cleaning and inspection area
[Translate to Chinese:] Electrical probing
[Translate to Chinese:] Mounting area
[Translate to Chinese:] Bonding area
[Translate to Chinese:] Testing area
[Translate to Chinese:] Premounted sensors
